Yarn processing system
US6519152B1 · kind B1 · utility
3Cited by
7References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Mar 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A yarn processing system, e.g. a yarn feeder comprising a housing in which at least one semiconductor component is arranged on a printed circuit board. The semiconductor component lies on a heat conducting body which is in the form of at least one prolongation of the housing that extends through the printed circuit board up to the semiconductor component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.