Patent · US Expired

Method of formable thermoplastic laminate heated element assembly

US6519835B1 · kind B1 · utility

22Cited by
240References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 18, 2000
Grant dateFeb 18, 2003
Priority date
Expiry dateAug 18, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49085
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A semi-rigid heated element assembly and method of manufacturing semi-rigid heated element assemblies is provided. A heated element assembly includes a first thermoplastic sheet, a second thermoplastic sheet, and a resistance heating element laminated between the first and second thermoplastic sheets. The resistance heating element includes a supporting substrate having a first surface thereon and an electrical resistance heating material forming a predetermined circuit path having a pair of terminal end portions. The circuit path continues onto at least one flap portion that is capable of rotating about a first axis of rotation. The reformable continuous element structure may be formed into a final element assembly configuration whereby at least the flap portion is rotated along its axis of rotation to provide resistance heating in at least two planes. Semi-rigid heating elements may be formed into heated containers, heated bags, and other objects with complex heat planes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.