Method and apparatus for a direct bonded isolated pressure sensor
US6520020B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2000 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jan 6, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0075
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor integrally formed in the shape of a beam around a central channel. The beam has an integral blind end that is pressurized by the fluid. The beam has an opposite end that is shaped to provide a stepped corner with a gap opening at the base of the stepped corner, where the gap and isolated from the fluid. A sensing film in the channel adjacent the blind end has an electrical parameter that varies with pressure and electrical leads that extend from the channel and out the gap. A seal fills the gap around the leads and the seal fills a portion of the stepped corner. The sensor is preferably formed by direct bonding of single crystal alumina layers. Applications include industrial pressure transmitters, aerospace and turbine engine pressure sensing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.