Patent · US Expired

Method for making and testing thermocompression bonds

US6520026B1 · kind B1 · utility

2Cited by
15References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 3, 1999
Grant dateFeb 18, 2003
Priority date
Expiry dateNov 3, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19041
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for making and testing the thermal compression bond between a wire and a contact or terminal lead of a connector wherein the wire and contact/terminal lead are positioned between opposing electrodes, and a direct current is passed through the electrodes, wire and contact/terminal lead to make a direct attach thermocompression bond. Sample bonds are subjected to a peel test to determine if the thermocompression bonds are within specification. The peel test includes securing the contact/terminal lead, bend the wire 90 degrees from the contact/terminal lead, and applying force to the wire at a constant rate of pull until thermocompression bond is broken and the wire is separated from the contact/terminal lead. The peel force required to break the bond is then compared to a standard to determine if the thermocompression bonds are within determined specifications. Additionally, an axial pull test may also be performed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.