Heat sink having bonded cooling fins
US6520248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink has a surface with a plurality of slots having mutually facing sidewalls which converge toward the base of the slot at an angle. Each slot receives an end portion of a cooling fin having sidewalls which converge at the same angle, so that the sidewalls of the slot are at least substantially parallel to the sidewalls of the cooling fin. The slots are preferably machined in the base and the sidewalls on the fins are machined or coined, yielding tolerances which are so close that the gap between parts is less than 60 microinches, and unfilled adhesive can be used. The thinness of the bond provides good thermal conductivity and reduced curing time. It is also possible to, provide the slots with a slightly smaller angle so that the base deforms to accommodate the cooling fin and adhesive may be eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.