Patent · US Expired

Packaging for planiform objects/products

US6520329B1 · kind B1 · utility

25Cited by
15References
8Claims
0Family size

Assignees

Inventors

Key dates

Filing dateAug 17, 2001
Grant dateFeb 18, 2003
Priority date
Expiry dateAug 17, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65D2575/3227
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

The invention relates to a packaging for planiform objects/products such as susceptors, wafers, chewing gum, TTS, TDDS, TDS, stamps, microchips or like. Said packaging consists of a support card (1) with one or more cavities (2) for receiving the object(s). The upper side of said support card is covered by a cover film (3) which occludes the cavities and which is sealed with th support card at sealing lines (4) at least in the marginal area around the cavities in such a manner that sad film can be torn open. Said sealing lines are surrounded by a weakened line (c) the cover film which merges into the contour of a tab (3a) for grasping and manually tearing open the cover film above the respective cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.