Packaging for planiform objects/products
US6520329B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 17, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Aug 17, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2575/3227
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The invention relates to a packaging for planiform objects/products such as susceptors, wafers, chewing gum, TTS, TDDS, TDS, stamps, microchips or like. Said packaging consists of a support card (1) with one or more cavities (2) for receiving the object(s). The upper side of said support card is covered by a cover film (3) which occludes the cavities and which is sealed with th support card at sealing lines (4) at least in the marginal area around the cavities in such a manner that sad film can be torn open. Said sealing lines are surrounded by a weakened line (c) the cover film which merges into the contour of a tab (3a) for grasping and manually tearing open the cover film above the respective cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.