Thermosonic bonding apparatus, tool, and method
US6520399B1 · kind B1 · utility
7Cited by
18References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Sep 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm interconnecting the bonding tool and the ultrasonic transducer to vibrate the high resistivity bonding tool tip; and a voltage source connected to the bonding tool to locally heat the high resistivity bonding tool tip in a pulsed fashion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.