Wire tensioning apparatus
US6520400B2 · kind B2 · utility
2Cited by
14References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jul 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device and method for providing tension and a reserve wire reservoir to a bonding wire for use with a bonding machine. The device includes an outlet port providing fluid under pressure, and a surface along which the pressurized fluid flows in a direction away from the outlet port such that the bonding wire follows a path along the surface and the pressurized fluid places a uni-directional tension on the bonding wire while maintaining a reserve portion of wire in a slack loop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.