Thermal transfer of microstructured layers
US6521324B1 · kind B1 · utility
87Cited by
51References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/89
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the microstructured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.