Patent · US Expired

Application and manufacturing method for a ceramic to metal seal

US6521350B2 · kind B2 · utility

56Cited by
5References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 6, 2001
Grant dateFeb 18, 2003
Priority date
Expiry dateOct 6, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/265
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the metal interlayer material, but that is less than the melting point of either the interlayer material, the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a homogeneous and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.