Curable resin composition, method for the preparation thereof, and articles derived thereform
US6521703B2 · kind B2 · utility
37Cited by
57References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jan 19, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G63/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition includes an unsaturated polyester, an alkenyl aromatic compound, and a capped poly(arylene ether). The composition is suitable for low temperature curing and exhibits reduced curing shrinkage and reduced brittleness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.