Patent · US Expired

Low-density polyethylene resin for laminating, composition thereof, laminates produced therefrom and process for producing the same

US6521734B1 · kind B1 · utility

9Cited by
2References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 30, 2000
Grant dateFeb 18, 2003
Priority date
Expiry dateMar 30, 2020

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L23/0853
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to a low-density polyethylene resin for laminates, a composition thereof, and a laminate and production method therefor. The low-density polyethylene resin is one obtainable by a high pressure radical polymerization method and has a density of 0.910 to 0.935 g/cm3, a melt flow rate of 0.1 to 300 g/10 min., and a terminal vinyl group number of 0.4 or more per 1,000 carbon atoms. According to the invention, a laminate having high interlayer adhesion strength can be obtained also by low-temperature, high-speed molding so that the occurrence of smoking and odor can be prevented. Also, the resin is excellent in productivity and economics. Further, the resin is excellent in productivity and economics because it can be readily made thinner. The laminate is suitable for application to, for example, food wrapping materials, containers, etc.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.