Laser beam machining and laser beam machine
US6521866B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Sep 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Beam distributing/shaping units 21a and 21b the number of which is the same as the number of heads 7a and 7b are disposed in series with each other on an optical path of a laser beam 2 radiated from a laser oscillator 1. Then, the beam distributing/shaping units 21a and 21b are operated so that a laser pulse is supplied to one of the heads which has been positioned. By selecting the timing for operating the beam distributing/shaping units 21a and 21b, the laser beam 2 having energy the magnitude of which is substantially fixed is supplied to a portion to be machined. Thus, the laser oscillator is used effectively, and the machining energy is controlled accurately so that a high-quality hole can be machined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.