Methods and apparatus for hermetically sealing electronic packages
US6521989B2 · kind B2 · utility
35Cited by
25References
41Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 8, 1998 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Oct 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and/or package lid includes at least one connection slot for receiving a line, such as an optical fiber. The package and/or package lid also includes at least one sealant slot proximate the connection slot. Optical fibers are connected to a component, such as an opto-electronic component, through the connection slot. A sealant provided via the sealant slot hermetically seals the optical fibers within the connection slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.