Plasma display panel with an auxiliary bonding pad
US6522073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Sep 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A display panel is disclosed. The display panel includes a substrate having an edge and a printed circuit board. A plurality of bonding electrodes are formed on the substrate, and positioned along the edge of the substrate. Each bonding electrode neither overlaps nor connects with any of the other bonding electrodes. The bonding electrodes are spaced from the edge of the substrate by a distance. A plurality of board electrodes are formed on the printed circuit board. Each board electrode neither overlaps nor connects with any other board electrodes. The position of each board electrode corresponds to that of one of the bonding electrodes. An auxiliary bonding pad is formed between the bonding electrodes and the edge of the substrate. When a conductive adhesive layer and a protective adhesive layer are formed to adhere the substrate with the printed circuit board, the auxiliary bonding pad can reduce a space formed between the bonding electrodes and the conductive adhesive layer, and also eliminates the possibility of the bubble formation therebetween. Therefore, the substrate is completely sealed with the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.