Reconfigurable multichip module stack interface
US6522518B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2000 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and apparatus provide for the packaging of electronic components as well as a monitoring system to periodically check and adjust connections between the various electronic components. A multichip module (MCM) may be employed with an interposer and circuit card interface to comprise an electronic assembly. Each of the components in the assembly includes external electrical contacts which provide for the conduction of electrical signals between the components as well as to remotely located systems. The electronics assembly further includes an actuator assembly which is employed to apply a compressive force to the electronic components in a stacked configuration and to periodically measure the resistance over a feedback circuit to determine that there is still a good electrical connections between the contacts. If the measured resistance is above a predetermined level, the compressive force may be increased to improve the electrical connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.