Non-contacting type IC card and method for fabricating the same
US6522549B2 · kind B2 · utility
26Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Sep 24, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07783
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The swelling in the surface of an IC card due to occluded pneumatic foams is eliminated by providing a novel IC card, which is comprised of a substrate mounting an IC chip and an antenna circuit, and wherein the substrate is sandwiched at least between a pair of films, and the pair of the films are provided with an uneven pattern made of small grooves formed at least on one surface thereof opposing the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.