Silicon-based sensor system
US6522762B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2000 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | May 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R25/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.