Patent · US Expired

Support for components used in microsystems technology

US6523362B2 · kind B2 · utility

3Cited by

14References

9Claims

0Family size

Assignee

ABB RESEARCH LTD. · CH

Inventors

Dieter Binz · Hirschberg, DE
Albrecht Vogel · Oberkochen, DE
Peter Krippner · Karlsruhe, DE

Key dates

Filing date	Jan 10, 2002
Grant date	Feb 25, 2003
Priority date	—
Expiry date	Jan 10, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A support element is described which can combine components used in Microsystems technology to form a single unit. Because of the very small dimensions of the support element, it is difficult to keep the components at different temperatures if this is required for them to operate. With the support element, this difficulty is avoided by the fact that at least one thermal insulation device, which shields the plate and the cover of the support element with respect to internal and external environments in certain regions, is provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.