Method for separating metallic from waste printed circuit boards, and dry distillation apparatus used for waste treatment
US6523764B2 · kind B2 · utility
4Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2001 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Apr 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S241/38
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for treating waste printed circuit boards, the method has the steps of:heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher;pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; andseparating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.