Patent · US Expired

Thermal analysis assembly with distributed resistance and integral flange for mounting various cooling devices

US6523998B1 · kind B1 · utility

14Cited by
18References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 26, 2001
Grant dateFeb 25, 2003
Priority date
Expiry dateFeb 19, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N25/4826
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An improved differential thermal analysis/differential scanning calorimetry (collectively, DSC) assembly with a furnace block assembly having a measurement chamber and a furnace heater. The measurement chamber has a sensor assembly for receiving a sample material and a reference material. The furnace block assembly is coupled to a generally cylindrical cooling flange through a distributed thermal resistor that allows a constrained heat flow between the furnace assembly and cooling flange. The thermal resistor can also withstand the mechanical stresses associated with the differential expansion and contraction of the furnace assembly and cooling flange without permanent deformation of the thermal resistor. The cooling flange can be coupled to various cooling devices, permitting operation of the overall DSC instrument in a variety of temperature regimes for a variety of applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.