Facility for the thermal treatment of workpieces

US6524100B2 · kind B2 · utility

Assignee

• ERSA GMBH · DE

Inventors

• Rainer Kurtz · Wertheim, DE
• Bernd Schenker · Boxberg, DE
• Richard Kressmann · Monsheim, DE

Key dates

• Filing date: Jun 28, 2001
• Grant date: Feb 25, 2003
• Expiry date: Jun 28, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1702
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.