Methods for molding and grafting highly uniform polymer layers onto electronic microchips
US6524517B1 · kind B1 · utility
9Cited by
17References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1999 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Dec 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Microreaction molds and methods of molding very thin films onto substrate surfaces are provided. The molds and molding methods allow for consistency and uniformity in the thicknesses of the films that are applied to the substrate surfaces. The molds may be single composite, such as etched silica, or multicomposite, such as quartz/metal. The molds may further comprise an adjustable molding cavity. The molds of this invention are particularly applicable to generating thin polymeric films onto microchip substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.