Process for the electroless deposition of metal on a substrate
US6524645B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1994 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Oct 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for the metalization of substrates is disclosed. The metal either forms a coating over the entire substrate, or it is patternwise deposited on the substrate surface. Metal is patternwise formed on the substrate either by forming a pattern of resist material on the substrate and depositing the material in the interstices defined by the pattern or by forming a patterned resist layer over a metal layer and transferring the pattern into the substrate using conventional techniques. The patterned resist layer is formed on the substrate using conventional techniques. The substrate is treated with reagents that promote the electroless plating of metal on the substrate surface. If the resist material has been previously formed on the substrate surface, the substrate surface is then dried. The remaining resist is then removed from the substrate surface. The substrate surface is then exposed to an electroless plating bath to form nickel onto those portions of the substrate surface that were treated with the sensitizing and activating solutions. The substrate is then heated to at least 180° C. Additional layers of metal are formed on the substrate. After the additional layers are…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.