Patent · US Expired

Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof

US6524662B2 · kind B2 · utility

76Cited by
25References
12Claims
0Family size

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Inventors

Key dates

Filing dateJul 9, 1999
Grant dateFeb 25, 2003
Priority date
Expiry dateJul 9, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC30B29/06
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

The present invention is related to a method of crystallizing an amorphous silicon layer and a crystallizing apparatus thereof which crystallize an amorphous silicon layer using of electric fields and plasma. The present invention includes the steps of depositing an inducing substance for silicon crystallization on an amorphous silicon layer by plasma exposure, and carrying out annealing on the amorphous silicon layer while applying an electric field to the amorphous silicon layer. The present invention includes a chamber having an inner space, a substrate support in the chamber wherein the substrate support supports a substrate, a plasma generating means in the chamber wherein the plasma generating means produces plasma inside the chamber, an electric field generating means in the chamber wherein the electric field generating means applies electric field to the substrate, and a heater at the substrate support wherein the heater supplies the substrate with heat.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.