Carbon-bonded metal structures and methods of fabrication
US6524707B1 · kind B1 · utility
4Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 6, 2000 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Jul 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a technique in which a carbon structure is first coated with a tie layer as a intermediate prior to the deposition of metal on a carbon substrate. The tie layer is composed of a material with structural and chemical affinity for both carbon and metal. Capacitor electrodes formed according to this technique show very low Equivalent Series Resistance (ESR) and improved capacitance at high frequencies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.