Method to reduce release time of micromachined devices
US6525352B1 · kind B1 · utility
7Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2001 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Apr 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00547
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for fabricating a micromachined device with a fast release step is provided. A first undoped sacrificial layer is deposited on a structural layer. A doped sacrificial layer is deposited on the first undoped sacrificial layer. A second undoped sacrificial layer is deposited on the doped sacrificial layer to produce a layered structure. An etchant is then applied to the layered structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.