Multinode high density computing apparatus
US6525926B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 11, 2000 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Jul 11, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular multinode computing apparatus includes a rack mountable enclosure and more than one system board that is secured within the enclosure in a high density configuration that is preferably configured so that the system boards are positioned in substantially the same plane, which is also the plane in which the apparatus resides when mounted within a rack. The enclosure preferably has four system boards, and is sized as a 1 u form factor. When mounted in a rack with like units, the apparatus permits a data center or computing cluster to be fabricated that has a processing density that is much greater than conventional clusters that are configured with 1 u based single node units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.