Low profile highly accessible computer enclosure with plenum for cooling high power processors
US6525935B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2001 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Mar 12, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A low profile highly accessible computer enclosure with a processor plenum for cooling high power processors is disclosed. The enclosure includes one or more air movement devices that discharge air into a plenum. The plenum channels the air to a location proximate to one or more high power processors where it is discharged over the processors. The velocity of the air is sufficient to achieve a convection coefficient that will cool the high power processors. The enclosure can also be slidably mounted in a computer rack and include a multi-section top cover. While the computer is operating, an operator can access, inspect, service, repair, or replace components within server by sliding the server out of the front and/or rear of the computer rack and then removing one or more of the cover sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.