Integrated apparatus for thermal dissipation
US6525940B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated apparatus for thermal dissipation suitable for the thermal dissipation of the display chip and the memory chip on a display card. It comprises a baseboard, which contains the first side and the second side. The sets of first and second fins are located on the first side in which the first set is perpendicular to the first side and the second set forms an angle other than 90 degrees with the first side. The second side is in contact with both the display chip and the memory chip. A board hook is located on one side of baseboard that clamps on the edge of the display card. As well as, a fan is located on the first side between the sets of first and second fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.