Header assembly for mounting to a circuit substrate and having ground shields therewithin
US6527587B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1999 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Apr 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6585
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A header assembly is mounted to a backplane and receives a complementary electrical connector. The header assembly has an insulating shroud having a base with backplane and connector sides and a primary edge, and differential signal pin pairs, ground shields, and ground pins mounted to the base. The signal pin pairs are arranged into rows extending in a first direction along the base and along the base primary edge, and columns extending in a perpendicular second direction along the base. The signal pins in each pair are adjacently arranged into a sub-row extending in the first direction. Each signal pin in a pair has an inner side facing the other pin in the pair, an opposing outer side, and primary and non-primary sides facing toward and away from the base primary edge, respectively. One ground shield is associated with each signal pin. Each ground shield extends through the base between the connector side and the backplane side, and includes first and second attached wings arranged at right angles. The first wing extends along the first direction adjacent and along either the primary or non-primary side of the associated signal pin, and the second wing extends along the second d…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.