Silver alloy plating bath and method of forming a silver alloy film by means of the same
US6527840B1 · kind B1 · utility
6Cited by
5References
8Claims
0Family size
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Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/64
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A silver alloy plating bath and a method of forming a silver alloy film by using the silver alloy plating bath and by performing displacement plating on surfaces of a more base metal than silver, the silver alloy plating bath including Ag ions and at least one or more metal ions of Pd ions, Pt ions, Au ions and Rh ions, a concentration of the Ag ions and the metal ion or ions being 0.001 to 0.01 mol/l, a mol ratio of the metal ion or ions to the Ag ions being 1:0.01 to 0.1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.