Patent · US Expired

Apparatus and method for deposition of thin films

US6527866B1 · kind B1 · utility

73Cited by
4References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 9, 2000
Grant dateMar 4, 2003
Priority date
Expiry dateFeb 9, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S505/826
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An apparatus for forming a multicomponent thin film, such as a superconducting thin film, on a substrate includes a holder for holding at least one substrate and a deposition/reaction vessel. The deposition/reaction vessel has at least three zones, each zone being separated from adjacent zones by a wall. The zones include at least two deposition zones, where each deposition zone is configured and arranged to deposit a deposition material on the at least one substrate, and at least one reaction zone for reacting the deposition material with a reactant. The apparatus is configured and arranged to rotate the at least one substrate sequentially through the plurality of zones to form a thin film on the substrate. In some embodiments of the apparatus, the deposition/reaction vessel includes a same number of deposition zones and reaction zones which may be alternating deposition and reaction zones.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.