Patent · US Expired

Method and device for producing segmented contact adhesive layers and for applying the same on a substrate

US6527897B1 · kind B1 · utility

6Cited by
8References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 6, 2000
Grant dateMar 4, 2003
Priority date
Expiry dateNov 6, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/171
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

The invention relates to a process and a device for manufacturing segmented pressure-sensitive adhesive layers and applying the same to a substrate, involving the use of a reaction medium containing radiation-inducible polymers and/or prepolymers of olefinically unsaturated compounds and the addition of a photoinitiator.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.