Method and device for producing segmented contact adhesive layers and for applying the same on a substrate
US6527897B1 · kind B1 · utility
6Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Nov 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/171
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The invention relates to a process and a device for manufacturing segmented pressure-sensitive adhesive layers and applying the same to a substrate, involving the use of a reaction medium containing radiation-inducible polymers and/or prepolymers of olefinically unsaturated compounds and the addition of a photoinitiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.