Hard carbon thin film and method of forming the same
US6528115B1 · kind B1 · utility
14Cited by
24References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Feb 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hard carbon thin film formed on a substrate has a graded structure in which a ratio of sp2 to sp3 carbon-carbon bonding in the thin film decreases in its thickness direction from a thin film/substrate interface toward a surface of the thin film. A method of forming the thin film involves varying the film-forming ion species over time to produce the composition gradient or structural gradient in the thickness direction of the thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.