No-flow flux adhesive compositions
US6528169B2 · kind B2 · utility
5Cited by
11References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Jun 25, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.