PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE
US6528231B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 24, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Jan 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.