Patent · US Expired

Lead frame device and method for producing the same

US6528868B1 · kind B1 · utility

19Cited by

10References

6Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Kurt Weiblen · Metzingen, DE
Stefan Pinter · Reutlingen, DE
Frieder Haag · Wannweil, DE

Key dates

Filing date	Oct 12, 2000
Grant date	Mar 4, 2003
Priority date	—
Expiry date	Oct 12, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made of silicon which is mounted in the die pad area on the lead frame to accommodate the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.