Semiconductor device having a plurality of stacked wiring boards
US6528870B2 · kind B2 · utility
86Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2001 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Jan 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.