Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
US6529379B1 · kind B1 · utility
8Cited by
17References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1998 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Providing a layer of ZnCr intermediate a dielectric substrate and a heat spreader enhances the adhesion between the dielectric substrate and heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.