Microfiber dielectrics which facilitate laser via drilling
US6530147B1 · kind B1 · utility
18Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Nov 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.