Molding die for use with a sol-gel composition
US6530554B2 · kind B2 · utility
10Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Apr 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/81
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding die having satisfactory releasability, a sol-gel composition produced using the molding die, and a process for producing a sol-gel composition. The molding die which is to be pressed against a sol-gel material for producing a sol-gel composition has a release film, e.g., a thin gold (Au) film, formed on the molding surface of the molding die through a buffer layer made of metals and/or inorganic oxides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.