Method and apparatus of connection to an electrical film device
US6530776B1 · kind B1 · utility
10Cited by
12References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/017
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for connection of a conductor to a thick film pad is disclosed. Pressure and frictional force are combined to produce a reliable metallurgical bond between the conductor and the thick film pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.