Stabilized slurry compositions
US6530967B1 · kind B1 · utility
4Cited by
21References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1999 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Nov 24, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided are slurry compositions suitable for use in a chemical-mechanical planarization process and methods for making same. The compositions include: (a) abrasive particles dispersed in a suspension medium; (b) a peroxygen compound; and (c) a stabilizing agent. The stabilizing agent includes a phosphoric acid, a salt of a phosphoric acid or combinations thereof. The invention has particular applicability to the semiconductor manufacturing industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.