Method of forming a shaped body of brittle ultra fine particles with mechanical impact force and without heating
US6531187B2 · kind B2 · utility
20Cited by
6References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Mar 29, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B35/645
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of forming a film or a micro structure having high density and high strength by bonding brittle ultra fine particles without heating them. The brittle ultra fine particles blown to a substrate are applied with a mechanical impact force to break and bond them together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.