Photosensitive copper paste and method of forming copper pattern using the same
US6531257B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Nov 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.