Surface micromachining using a thick release process
US6531332B1 · kind B1 · utility
8Cited by
9References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 10, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Jan 10, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0107
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A hybrid process combines a thin-film surface micromachining process such as by sputtering, evaporation or chemical vapor deposition with a thick-film surface micromachining and release process such as dry-film lamination. Such combination results in thin film micro-structures with all the benefits of surface micromachining without the typical problems of stiction and limited range of motion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.