Multilayer printed circuit board and method of making the same
US6531661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Jun 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.