Circuit board, battery pack, and method of manufacturing circuit board
US6531662B1 · kind B1 · utility
26Cited by
5References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 19, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Oct 19, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit substrate (10) comprises a first substrate split (11) formed with a predetermined wiring pattern (16) and a second substrate split (12) formed with a predetermined wiring pattern (17). The substrate splits are electrically and/or mechanically joined together, and the circuit substrate is bent at the joint. The joint is provided by a bendable joint member (13) including a plurality of leads (14) disposed in parallel and held by a thin piece of base film (20) integrally therewith. The joint member is attached to interconnect the first and the second substrate splits (11, 12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.