Patent · US Expired

Method for the laser machining of organic materials

US6531679B2 · kind B2 · utility

10Cited by

11References

17Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Marcel Heerman · Merelbeke, BE
Eddy Roelants · Brugge, BE
Hubert De Steur · Drongen, BE

Key dates

Filing date	Sep 27, 2001
Grant date	Mar 11, 2003
Priority date	—
Expiry date	Sep 27, 2021

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

For the laser machining of organic materials, a laser with the below listed parameters is used. The laser has a wavelength of 300 nm to 1200 nm, a pulse width of <50 ns and a pulse frequency of >20 kHz. To increase a degree of absorption and consequently the machining rate, additives with good absorption of the laser beam with the respectively chosen wavelength are admixed with the organic materials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.